McLantis Hong Kong — Global Gateway for
Precision Laser & Semiconductor Equipment
Bridging Cutting-Edge Optical R&D with Worldwide Industrial & Microelectronics Manufacturing.
High-precision manufacturing & optical platforms
LDI · Laser Direct Imaging
Sub-micron inner-layer and solder-mask imaging for advanced PCB fabrication.
CTS · Laser Imaging
Direct laser screen and photomask fabrication for industrial printing.
MEMS · Laser Micro-Packaging
Micro-welding and hermetic sealing for advanced semiconductor packages.
3D Curved Cover Glass Photolithography
Maskless DLP direct-write lithography for 3D curved automotive cover glass — micron alignment, >95% first-pass yield.
Banknote-grade Anti-counterfeiting Platemaking
Artline security design & prepress for guilloche, microtext and latent-image banknote-grade protection.
Additive Manufacturing · 3D Printing
Industrial metal and polymer additive manufacturing for complex consolidated parts and rapid prototyping.
Digital Inkjet Publishing System
On-demand inkjet publishing with variable data, short-run books and high-speed duplex output.
Global Trade Hub
Hong Kong compliance, customs and financing backbone for cross-border equipment flows.
ISO 9001 · CE Certified
Audited quality and conformance for international procurement.
Core high-precision manufacturing systems
From lithography and micro-packaging to curved-glass photolithography and security platemaking, our platforms are built for the tolerances of next-generation electronics.
LDI — Laser Direct Imaging
Direct-write exposure eliminates phototools and delivers sub-micron registration for HDI, rigid-flex and advanced substrate lines.
- Sub-micron alignment
- Phototool-free workflow
- Rigid-flex & IC substrate ready
- Resolution
- ≤ 1 µm
- Throughput
- up to 8 panels/min
- Substrate
- FR-4 / PI / glass
CTS — Laser Imaging
Computer-to-screen laser imaging produces high-density meshes and photomasks for precision industrial and graphic printing.
- High-density mesh
- Direct mask exposure
- Repeatable registration
- Line density
- ≥ 200 LPI
- Format
- up to 1.6 × 2.0 m
- Repeatability
- ± 5 µm
MEMS — Laser Micro-Packaging
Ultra-fine laser micro-welding and hermetic sealing for MEMS, sensors and advanced semiconductor packages.
- Hermetic sealing
- Minimal heat-affected zone
- Wafer-level capable
- Spot size
- ≥ 10 µm
- Sealing
- hermetic / vacuum
- Materials
- Si / glass / metal
3D Curved Cover Glass Photolithography
Brings semiconductor negative-photoresist microfabrication onto 3D curved automotive cover glass. A DMD direct-write exposure head, 3-axis real-time profiling and CCD vision alignment deliver micron-level window control and first-pass yield above 95%.
- Any curved shape — 3D / 3.5D
- Maskless direct-write, micron window control
- First-pass yield > 95%, ~400 pcs/line/day
- Resolution
- 20–40 µm
- Registration
- ± 10 µm
- Exposure field
- 1200 × 600 × 200 mm
- Light source
- 405 + 375 nm laser
Banknote-grade Anti-counterfeiting Platemaking
The Artline security system provides 16 anti-counterfeit modules — guilloche, latent image, microtext, rainbow, open-lock and more — for banknote, certificate, document and packaging prepress. Trusted by central banks and government issuers.
- 16 security modules (guilloche / latent / microtext / rainbow…)
- Prepress only — no change to print process or cost
- Naked-eye verifiable, scan-resistant
- Microtext
- ≤ 0.2 mm
- Applications
- banknote / document / label / pack
- Verification
- visual + optical
- Investment
- one-time, lifetime use
One Hong Kong hub. Three engines of global delivery.
We turn Hong Kong's trade, compliance and R&D strengths into a single global platform that moves high-precision equipment from factory to fab worldwide.
Corporate Compliance & Global Trade
Hong Kong-incorporated holding with international trade licensing, customs and financing backbone — giving overseas buyers audited, compliant procurement.
Cross-Border Supply Chain Logistics
End-to-end orchestration of freight, bonded warehousing and last-mile commissioning across Europe, the Middle East, Southeast Asia and the Americas.
Advanced Optical & MEMS R&D Integration
Tight coupling of Shanghai, Beijing and Hong Kong R&D with manufacturing keeps LDI, CTS and MEMS platforms at the precision frontier.
Built for global B2B procurement
A transparent, audited multinational structure — backed by SPIE and OPTICA lifetime membership — gives overseas buyers and agents the confidence to procure at scale.
Quality management system, independently audited.
Conformity for the European Economic Area.
Environmental management compliance.
Multinational structure
Seeking global agents & strategic buyers
We are expanding our partner network for high-end laser equipment across Europe, the Middle East and Southeast Asia.
Contact the Hong Kong team- 📍Unit 1806, 18/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Kowloon, Hong Kong
- ☎️+852 6610 5035
- ✉️info@mclantis.hk